According to different application occasions, different shape scales, heat dissipation plans and luminous effects, LED packaging methods are varied. At present, leds are mainly classified as lamp-led, top-led, side-led, smd-led, high-power-led, flip chip-led and so on.

lamp-led(in-line led) : The early appearance of lamp-led is in-line led, and its package is potting. The process of potting is to first inject liquid epoxy resin into the led molding cavity, and then Pierce the pressed welded led bracket, put it in the oven to let the epoxy resin cure, and then the led is detached from the mold cavity and formed. Due to the relatively simple production process and low cost, it has a high market share.